技术规格Specifications | |||
Model No. | 型号 | ES-300A | |
Control Method | 控制方式 | Switching Control | |
PCB Size(mm) | PCB板尺寸 | Max.300mm | |
Conveyor Speed | 传输速度 | 100~2400mm/min. | |
Pre-heating Zone | 预加热区 | Length:1200mm×1 Room Temperature-200℃ | |
Solder Pot Temperature | 锡炉温度 | Room Temperature~300℃ 室温~300℃ | |
PCB Conveyor Direction | PCB板传送方向 | L R/L R | |
PCB Conveyor Height | PCB板传送高度 | 750±20mm | |
PCB Soldering Angle | PCB板过锡角度 | 4~6° | |
Flux Spraying Pressure/Flow Rate | 松香喷雾气压/流量 | 3-4kgf/cm2 10~100ml/min. | |
Flux Capacity | 松香容量 | Approx.4Liters | |
Spraying Nozzle Move | 喷头移动方式 | Stepper Motor步进电机 | |
Solder Pot Capacity | 锡炉容量 | Approx.265kg | |
Solder Type | 适用焊料类型 | Normal Solder普通焊料 | |
Normal Power/Start up Power | 正常/启动功率 | Approx.3.5kw/14.5kw | |
Power Supply | 电源 | 3 phase 5 wires 380V 50/60Hz 三相五线制 | |
Outside Dimension | 设备外形尺寸 | L3300×W1100×H1500mm | |
Weight | 重量 | 700kg |
技术规格 | ||
型号 | ES-300A | |
控制方式 | 按键式控制系统 | |
PCB板尺寸 | Max.300mm | |
传输速度 | 100~2400mm/min. | |
预加热区 | 长度:1200mm×1 温度:室温-200℃ | |
锡炉温度 | 室温~300℃ | |
PCB板传送方向 | L R/L R | |
PCB板传送高度 | 750±20mm | |
PCB板过锡角度 | 4~6° | |
松香喷雾气压/流量 | 3-4kgf/cm2 10~100ml/min. | |
松香容量 | Approx.4Liters | |
喷头移动方式 | 步进电机 | |
锡炉容量 | Approx.265kg | |
适用焊料类型 | 普通焊料 | |
正常/启动功率 | Approx.3.5kw/14.5kw | |
电源 | 三相五线制 | |
设备外形尺寸 | L3300×W1100×H1500mm | |
重量 | 700kg |
ES-300A小型双波峰焊锡机
产品特点
· 炉胆采用分体型设计,小容量、小功率,单独温度控制,经济实用,省电40%。
· 特别加长预热区,预热曲线平稳,保证PCB板焊接效果。
· 采用速度自行跟踪喷雾系统(三菱PLC控制),使喷雾面积随PCB宽度自动调节。
· 内置助焊剂喷头自动清洗系统,长期使用亦无需清洗。
· 具有经济运行功能,锡波随PCB自动起降,降低氧化量。
·锡渣正常工作氧化量<1.5公斤/8小时。
ES-300A Direct Dual-wave Soldering machine
Features
Solder pot adopts separate type design,small capacity,low power,independent temperature control,economical and practical, saving electricity by 40%.
Specially extended preheating area, where the preheating profile is stable and can ensure the soldering effect of PCB boards.
Adopting speed auto-track spraying system(Mitsubishi PLC control),making the spraying area automatically adjusted with the width of PCB.
Embeded cleaning system for flux nozzle head, no cleaning is requried even after used for a long time.
With economical operation function, the wave rises and falls with PCB and the quantity of oxidation is reduced.
Normal oxidation quantity of the lead-free soldering is<1.5kg/8h.
Specifications | ||
Model No. | ES-300A | |
Control Method | Switching Control | |
PCB Size(mm) | Max.300mm | |
Conveyor Speed | 100~2400mm/min. | |
Pre-heating Zone | Length:1200mm×1 Room Temperature-200℃ | |
Solder Pot Temperature | Room Temperature~300℃ | |
PCB Conveyor Direction | L R/L R | |
PCB Conveyor Height | 750±20mm | |
PCB Soldering Angle | 4~6° | |
Flux Spraying Pressure/Flow Rate | 3-4kgf/cm2 10~100ml/min. | |
Flux Capacity | Approx.4Liters | |
Spraying Nozzle Move | Stepper Motor | |
Solder Pot Capacity | Approx.265kg | |
Solder Type | Normal Solder | |
Normal Power/Start up Power | Approx.3kw/14.5kw | |
Power Supply | 3 phase 5 wires 380V 50/60Hz | |
Outside Dimension | L3350×W1100×H1500mm | |
Weight | 600kg |